Sr. Engineering Technician - Packaging Lab
- Location
- Austin (Oakhill, Office); Austin (Ed Bluestein, Office)
- Work mode
- On-site
- Employment type
- Full-time
Skills mentioned
- Semiconductor engineering
- Technical report writing
- Mechanical testing equipment
- Thermomechanical analysis
- Acoustic imaging
- Microsoft Office
- Project planning
- Equipment operation
- Chemical analysis
- Dynamic mechanical analysis
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About the job
Position Summary We are seeking a highly motivated Sr. Engineering Technician for Packaging Lab to support engineering development, characterization, and reliability activities in a fast-paced semiconductor environment.
The successful candidate will work closely with engineers, technicians, equipment vendors, and material suppliers to execute experiments, collect and analyze data, prepare technical reports, and contribute to continuous improvement initiatives.
The ideal candidate is proactive, detail-oriented, and capable of managing multiple projects simultaneously while working independently within established procedures.
Key Responsibilities
• Support engineering projects involving semiconductor materials, packages, and processes. • Operate, maintain, and troubleshoot laboratory, mechanical, and thermomechanical test equipment. • Execute experiments, gather data, and document results in a clear and organized manner. • Prepare technical reports and presentations summarizing findings and recommendations. • Work independently on assigned projects while meeting established timelines and objectives. • Collaborate with engineers, technicians, suppliers, and cross-functional teams to improve testing capabilities and processes. • Assist in developing and implementing process improvements to enhance efficiency, quality, and reliability. • Coordinate with equipment and material suppliers regarding technical support, maintenance, and enhancements. • Maintain laboratory equipment, tools, and work areas in accordance with safety and quality standards. • Follow all company safety, quality, and compliance requirements . Required Qualifications
- High School Diploma or GED required.
- 8+ years of experience in a technical, engineering, laboratory, manufacturing, or semiconductor environment.
- Experience working with mechanical and thermomechanical testing equipment.
- Ability to manage multiple tasks and priorities in a fast-paced environment.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication skills.
- Proficiency with Microsoft Office applications, including:
- Microsoft Word
- Microsoft Excel
- Microsoft PowerPoint
- Ability to write technical reports and effectively communicate test results.
- Ability to work both independently and collaboratively within a team environment.
Preferred Qualifications
- Minimum educational requirement is a High School Diploma or GED
- Experience with analytical test tools such as:
- Acoustic Imaging (C-SAM)
- Dynamic Mechanical Analysis (DMA)
- Thermal Mechanical Analysis (TMA)
- Nanoindentation Testing
- Four-Point Bend Testing
- Experience with chemical analysis techniques and laboratory testing methods.
- Previous experience in the semiconductor industry, materials characterization, or reliability testing.
Knowledge, Skills, and Abilities
- Strong attention to detail and commitment to data accuracy.
- Ability to interpret technical procedures and engineering documentation.
- Experience working with complex testing systems and laboratory equipment.
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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From US63 NXP USA Inc.'s careers page (Workday), checked 29 Oct 2026.
How to apply
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Posted 22 Oct 2026 · checked 29 Oct 2026 · Report this job